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Case Two

Release date: 2017-04-17 15:11:48 Visits: 2124

TSMC 40GP 1P10M
Flip-Chip LFBGA SiP 1Gb DDR3 KGD
Max Clock Freq: 515MHz
SerDes IP: 10Gbps
DDR3 IP: 800Mbps 
RGMII I/O
Voltage: 0.9V/1.8V device
Die size: 2.58x3.44mm^2

Direct production success





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